| 摘要 |
Provided are a method of verifying line reliability and a method of fabricating a semiconductor substrate to improve the line reliability. The semiconductor device fabricating method includes: forming an interlayer insulating layer having a via hole on a semiconductor substrate; forming a seed layer on the interlayer insulating layer; performing an ammonia plasma process on the seed layer to reduce the surface of the seed layer; and forming a copper line using the surface roughness reduced seed layer.
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