发明名称 Method for manufacturing image sensor
摘要 Provided is a method for manufacturing an image sensor. The method includes the following. A color filter layer is formed on a semiconductor substrate having a photodiode and a transistor formed thereon. A planarization layer is formed on the color filter layer. An LTO (Low Temperature Oxide) layer is formed on the planarization layer. A photoresist pattern is formed to correspond to the color filter layer on the LTO layer, and a reflow process is performed. A microlens array is formed by reactive ion etching the photoresist pattern and the LTO layer. A second reflow process may be performed on the photoresist pattern and/or the LTO layer during the reactive ion etching process.
申请公布号 US2008160664(A1) 申请公布日期 2008.07.03
申请号 US20070999239 申请日期 2007.12.03
申请人 DONGBU HITEK CO., LTD. 发明人 YUN KI JUN;HWANG SANG IL
分类号 H01L31/18;G02B3/00;G02B5/20;H01L27/14;H04N5/335;H04N5/369;H04N5/372;H04N5/374 主分类号 H01L31/18
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