发明名称 APPARATUS AND METHOD FOR REDUCING DEFECTS
摘要 An embodiment relates generally to an apparatus for reducing defects. The apparatus includes a spindle adapted to hold a wafer; and at least two light sources configured to direct light to a top-side and a back-side of the wafer
申请公布号 US2008160457(A1) 申请公布日期 2008.07.03
申请号 US20060617243 申请日期 2006.12.28
申请人 COLLINS SEAN MICHAEL;HALL DAVID C;JESSEN SCOTT W 发明人 COLLINS SEAN MICHAEL;HALL DAVID C.;JESSEN SCOTT W.
分类号 G03B27/68;G03F7/20 主分类号 G03B27/68
代理机构 代理人
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