发明名称 |
SOLDER PASTE COMPOSITION, SOLDER PRECOATING METHOD AND MOUNTED SUBSTRATE |
摘要 |
The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. A second solder paste composition contains a deposition solder material which deposits the solder by heating and a flux, and a metallic powder comprising metallic species different from metallic species constituting a metallic component in the deposition solder material and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the metallic component in the deposition solder material. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.
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申请公布号 |
US2008160331(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20080038404 |
申请日期 |
2008.02.27 |
申请人 |
HARIMA CHEMICALS, INC.;RENESAS TECHNOLOGY CORP. |
发明人 |
KUKIMOTO YOICHI;IKEDA KAZUKI;SAKURAI HITOSHI |
分类号 |
B23K35/36;B22F7/00;B22F7/02 |
主分类号 |
B23K35/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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