发明名称 |
Double side stacked die package |
摘要 |
A method of forming a package, comprising providing a set of dies on a substrate. The substrate may have a first die on its upper side and a second die on its lower side. A first interconnect may be provided in the substrate, wherein the first interconnect penetrates through the substrate to couple the dies to the substrate.
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申请公布号 |
US2008157322(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20060647086 |
申请日期 |
2006.12.27 |
申请人 |
TANG JIA MIAO;ZENG XIANG YIN;LU DAOQIANG;HE JIANGQI |
发明人 |
TANG JIA MIAO;ZENG XIANG YIN;LU DAOQIANG;HE JIANGQI |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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