| 摘要 |
Electronic equipment enclosure and electronic equipment having the enclosure are provided: the enclosure covers at least part of an electronic equipment main body. The enclosure includes a flat metal plate layer die cast on an inner surface; and a flat resin plate layer molded on an outer surface to almost entirely cover an outer surface of the metal plate layer. Further, the enclosure includes a two-layer structure of the metal plate layer and the resin plate layer.
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