LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package is provided to suppress optical loss and to improve luminous intensity by forming a light absorbing suppression unit at a mounting part of a light emitting diode chip. A package body(11) includes a mounting part of a groove structure and a first and second lead frames(12a,12b). At least, the first and second lead frames are partially positioned on the mounting part. A light emitting diode chip(15) is mounted on the mounting part in order to be electrically connected to the first and second lead frames. A light absorbing suppression unit(18) is formed in one region in the inside of the mounting part. The light absorbing suppression unit is composed of a mixture of high reflective powder having electrical insulating characteristics and a hardening transparent resin. The light absorbing suppression unit is formed at an inner sidewall of the mounting part and a bottom region adjacent to the inner sidewall in order not to contact the light emitting diode chip.