| 摘要 |
An agent for preventing the adsorption of the polishing product to a pad, a CMP (chemically mechanically polishing) slurry containing the agent, and a CMP method using the CMP slurry are provided to minimize the generation of scratch or the erosion of a wiring layer. An agent for preventing the adsorption of the polishing product to a pad comprises a pyridine-based compound containing at least two pyridinyl groups. Preferably the pyridine-based compound is represented by the formula 1 or 2, wherein A is a C1-C5 alkylene group or a C2-C5 alkenylene group; R1 and R2 are independently H, OH or COOH; X is CH or N; A1, A2 and A3 are independently NH, a C1-A5 alkylene group or a C2-C5 alkenylene group; n, m and l are independently 0 or 1 and at least two of them is 1; and R1, R2 and R3 are independently H, OH or COOH.
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