发明名称 |
THERMOSETTING RESIN COMPOSITION, ITS PRODUCTION METHOD, PREPREG USING THE SAME, AND LAMINATED PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can reduce the coefficient of thermal expansion while controlling increase in the volume fraction of an inorganic filler, and its production method, and to provide a prepreg using the thermosetting resin composition and a laminated plate using the prepreg. SOLUTION: The thermosetting resin composition comprises a thermoset resin (A) and an inorganic porous material (B), wherein a part of the thermoset resin (A) is impregnated into the holes of the porous material (B). The prepreg and the laminated plate using the composition are provided. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008150578(A) |
申请公布日期 |
2008.07.03 |
申请号 |
JP20070242515 |
申请日期 |
2007.09.19 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
MORITA KOJI;TAKANEZAWA SHIN;SAKAI KAZUNAGA;EJIRI TAKAKO;TSUCHIKAWA SHINJI;AKIYAMA MASANORI;KOTAKE TOMOHIKO |
分类号 |
C08L101/00;B32B15/08;C08G59/50;C08J5/24;C08K3/00;C08K3/36 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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