| 摘要 |
A lead frame includes a lead frame main body having a plurality of die pad portions each having a chip mounting surface on which a semiconductor chip is mounted, a plurality of lead portions provided to surround the plurality of die pad portions respectively, and a frame portion for supporting the plurality of die pad portions and the plurality of lead portions, an adhesive film pasted on a lower surface of the lead frame main body by pressing, and a first metal film provided on surfaces of the plurality of lead portions and connected electrically to the semiconductor chip respectively, wherein second metal films whose thickness is substantially equal to a thickness of the first metal film are provided to the chip mounting surface of the plurality of die pad portions respectively.
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