| 摘要 |
A method, apparatus, and system relating to an IC package. The method includes providing a leadframe including a die pad for receiving a die and a plurality interconnect pillars, attaching a die to the die pad, bonding the die to the leadframe, and encapsulating the die and the leadframe to form a first IC package having a top surface and an opposing bottom surface, where the interconnect pillars extend from the top surface of the first IC package to the bottom surface of the first IC package.
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