摘要 |
The present invention describes a tunable micro-antenna of reduced electrical dimensions. This antenna consists of the agglutination of several substrate layers ( 11 ), identical or distinct, with electrical, thermal and mechanical properties compatible with the manufacturing processes of integrated circuits. These layers are interleaved with metallic sheets ( 12 ) that are interconnected by metallized walls or vias, in such a way that they form a radiating structure ( 15 ) and a ground plane ( 14 ). The radiating structure includes slots in one or more levels, therefore allowing a greater reduction of the antennas' electrical length. These slots may include switches, used to render the antenna tunable. Since the entire manufacturing method is compatible with the wafer level packaging technology, the micro-antenna is easily integrable in microsystems requiring wireless communication
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