发明名称 |
METHODS FOR ELECTROLESS PLATING OF METAL TRACES ON A SUBSTRATE AND DEVICES AND SYSTEMS THEREOF |
摘要 |
Methods for forming traces/lines and interconnects on substrates and devices and systems thereof of herein disclosed. In some embodiments, an activator layer is deposited on a surface of a substrate. Pick-up lithography using a pre-patterned lithographic stamp, ultraviolet lithography or like methods are used to selectively remove portions of the activator layer to form a pattern on the surface of the substrate. Electroless metal deposition is then applied to the surface of the substrate to form a metal pattern selectively on the remaining activator layer. Electroless plating can then be used to form traces/lines and interconnects in dimensions of less than 10 micrometers.
|
申请公布号 |
US2008160177(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20060618528 |
申请日期 |
2006.12.29 |
申请人 |
MATAYBAS J C;SUPRIYA LAKSHMI;BCHIR OMAR |
发明人 |
MATAYBAS J. C.;SUPRIYA LAKSHMI;BCHIR OMAR |
分类号 |
B05D5/12 |
主分类号 |
B05D5/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|