NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND PRODUCTION METHOD THEREOF

摘要

Disclosed is a polyimide precursor composition which can be cured at low temperatures (250°C or less), while having low viscosity even at high concentration. Also disclosed is a method for producing such a polyimide precursor composition. Further disclosed are a polyimide coating film obtained from such a polyimide precursor composition and having good physical properties, a method for producing such a polyimide coating film, a photosensitive resin composition using such a polyimide precursor composition, and a method for producing such a photosensitive resin composition. The polyimide precursor composition is characterized by containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.