| 摘要 |
<p>A semiconductor package capable of conveniently performing underfill and an underfill method using the same are provided to introduce an insulation resin through a through-hole formed in a lower plate, thereby easily infiltrating the insulation resin between a package and a main substrate. A silicon chip(110) is provided on a lower plate(120) which is connected to terminal wires, through which to the silicon chip is communicated with external signal or is supplied with a power. The terminal wires are electrically connected to solder balls(140) placed on a bottom surface of the lower plate. The solder balls are to solder a semiconductor package to a main substrate and to serve as terminals. A mold resin layer is formed on an upper surface of the lower plate to protect the silicon chip. The lower plate is formed with through-holes(120a,120b).</p> |
