| 摘要 |
PROBLEM TO BE SOLVED: To optionally implement processings where common processing is applied to wafers in one cassette and different processings are applied to wafers in two cassettes used, when conveying the wafers in the cassette to a processing apparatus. SOLUTION: One cassette is used, and wafers contained in the cassette are conveyed to any process processing apparatus via conveying means, a load lock chamber, and vacuum conveying means, and further a common recipe is applied to the conveyed wafers for common processing, in one parallel processing. At least two cassettes are used, and wafers contained in each cassette are conveyed to different process processing apparatus for each cassette via conveying means, a load lock chamber, and vacuum conveying means, and further different recipe is applied to the conveyed wafers for every process processing apparatus for different processing parallel processing. Any of the parallel processings is optionally applied and wafers after processed by the parallel processing is returned to original cassettes via an unload lock chamber. Further, processing of all wafers in any cassette is finished, and during cassette exchange wafers in other cassette are conveyed out to continue the foregoing processing. COPYRIGHT: (C)2008,JPO&INPIT
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