发明名称 METHOD AND DEVICE FOR LOADING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To prevent a conductive ball from biting into between an array mask and a ball cup or ball sucking body when they move. SOLUTION: A loading method of a conductive ball for loading a conductive ball on an object using an array mask provided with through holes includes following means: firstly, a ball sucking body is provided which is provided above the array mask and is connected to a vacuum source for sucking the conductive ball to the lower surface; secondary, a vacuum switching means is provided to switch ON/OFF sucking state of the ball sucking body using the vacuum source; and thirdly, the vacuum switching means turns sucking state of the ball sucking body to be ON so that the conductive balls present below the ball sucking body are sucked by the ball sucking body, and then it turns the sucking state of the ball sucking body to OFF so that the conductive balls sucked by the ball sucking body drop, thereby the conductive balls are loaded on an object. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008153336(A) 申请公布日期 2008.07.03
申请号 JP20060338146 申请日期 2006.12.15
申请人 SHIBUYA KOGYO CO LTD 发明人 IKEDA KAZUO
分类号 H05K3/34 主分类号 H05K3/34
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