发明名称 Method of Manufacture of Encapsulated Package
摘要 There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.
申请公布号 US2008157433(A1) 申请公布日期 2008.07.03
申请号 US20080046969 申请日期 2008.03.12
申请人 发明人 HENG CHAI WEI;HENG YANG HONG;POH YONG CHERN
分类号 B29C39/10;B29C45/14 主分类号 B29C39/10
代理机构 代理人
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