| 摘要 |
A method for manufacturing a circuit board includes the steps of: forming a first wiring layer on a substrate; forming an insulating layer on the surface of the first wiring layer by means of electrophoretic deposition; forming a second wiring layer on the insulating layer and the surface of the substrate; and performing the follow-up procedures, such as forming a solder mask; thereby reducing the thickness of the circuit board and increasing the density of the circuit layout.
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