| 摘要 |
A wafer dryer and a method for drying a wafer using the same are provided to prevent leaning of storage node pattern by eliminating deionized water or Isopropyl alcohol between storage node cylinders. A wafer dryer comprises a chamber(110) including a wet bath(100) and a drying part(105), nozzles(115), a deionized water supply part(120), a deionized water temperature control part(125), an Isopropyl alcohol supply part(130), a flash tank(150), a first heater(160), and an inert gas supply part(140). The nozzles, placed inside the chamber, supply Isopropyl alcohol or deionized water vaporized on a wafer. The deionized water supply part supplies the deionized water into the chamber. The deionized water temperature control part, connected with the deionized water supply part, raises the temperature of the deionized water supplied into the chamber. The Isopropyl alcohol supply part supplies the Isopropyl alcohol into the chamber. The flash tank, placed between the chamber and the Isopropyl alcohol supply part, separates liquid component from vaporous component in the Isopropyl alcohol. The first heater adjusts the temperature of the Isopropyl alcohol supplied to the flash tank. The inert gas supply part increases the pressure inside the chamber by supplying inert gas into the chamber. The Isopropyl alcohol supply part also includes a first pump(170) which is coupled to the flash tank to control the circulation of the Isopropyl alcohol.
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