| 摘要 |
A method for eliminating foreign materials in manufacturing a flip chip mounting film is provided to prevent secondary contamination due to an adhesive material by using a rubber roller. A method for eliminating foreign materials in manufacturing a flip chip mounting film comprises a step of winding a flip chip mounting film wherein a pattern is formed through a photoresist coating step, an exposing step, a developing step, and a peeling step on an upper part of copper foil formed on an upper surface of PI(Polyimide)(20). A foreign material eliminating step for eliminating the foreign materials(21) on the PI via a foreign material eliminating device, installed at a lower part of the PI, is also included before wind of the flip chip mounting film after the peeling step. The foreign material eliminating step has the foreign material eliminating device made of a rubber roller(30).
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