| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film for dicing, where cut refuse (thread-shaped or whisker-shaped refuse generated from the film after dicing) scarcely occurs in the dicing process of a semiconductor wafer, and to provide a dicing film. SOLUTION: In the substrate film for multilayer dicing, a first layer includes a resin composition of 100 pts. wt made of 10-70 wt.% of a polypropylene-based resin (PP) and 30-90 wt.% of amorphous polyolefine and an olefine-based thermoplastic elastomer (TPO) of 10-200 pts. wt; a second layer includes a thermoplastic resin having rubber elasticity; and the first and second layers are laminated. COPYRIGHT: (C)2008,JPO&INPIT |
