| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for dicing and die bonding, and a method of manufacturing a semiconductor chip, by which even a semiconductor substrate of 80μm in thickness can be stably diced and be picked up at high speed. SOLUTION: The method of manufacturing a semiconductor chip includes a step wherein a film 10 for dicing and die bonding of which 180°peeling strength between a dicing film 8 and the adhesive layer 1 of a die bonding film 6 is 0.05-0.25 N/25 mm, preferably, less than 0.10 N/25 mm is employed, a semiconductor substrate 24 of 80μm in thickness and a ring frame 22 are adhered to the adhesive layer 2 of the die bonding film and the semiconductor substrate is diced; a step wherein the semiconductor chips, divided by dicing of the semiconductor substrate, are peeled between the adhesive layer of the die bonding film and the dicing film for pickup. COPYRIGHT: (C)2008,JPO&INPIT |
