发明名称 APPARATUS AND METHOD FOR PREPARING THIN SLICED SPECIMEN
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus for preparing thin sliced specimen, capable of preparing the thin sliced specimens of a fixed quality, without wrinkles in a thin slice, with a proper yield by surely placing thin slice on a plate, and to provide a method for preparing the thin slices. <P>SOLUTION: The apparatus for preparing the thin sliced specimen 1 is constituted so as to manufacture the thin sliced specimen P, by placing the thin slice B on the plate P1 and is equipped with: a holding frame forming means 18 for forming a holding frame P5, which has a hydrophobic film formed thereto in a substantially frame-like state so as to surround a holding range P6, containing at least a placing range P3, on which the thin slice B is placed, of the surface of the plate P1; an adhesive water supply means 17 for supplying adhesive water W in the holding range P6; a placing stand 4 on which the plate P1 is placed, in a state of having the adhesive water W; and a feed means 5 for feeding the thin slice B manufactured from an embedding block, to place the thin slice B inside the placing range P3 of the plate P1 placed on the placing stand 4. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008151657(A) 申请公布日期 2008.07.03
申请号 JP20060340187 申请日期 2006.12.18
申请人 SEIKO INSTRUMENTS INC 发明人 ITOU TETSUMASA;FUJIMOTO KOJI;MIYATANI TATSUYA
分类号 G01N1/06;G01N1/28 主分类号 G01N1/06
代理机构 代理人
主权项
地址