| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin, small and high-reliability solid-state imaging device capable of greatly inhibiting the permeation of a moisture while using a resin base material. SOLUTION: The device has the resin base material 12 forming a sensor loading region and lands 13 for connecting a sensor on one surface and forming the lands 14 for an external connection on the other surface and the semiconductor image sensor 21 loaded on the sensor loading region. The solid-state imaging device further has metal wires 22 electrically connecting electrode terminals 21a for the semiconductor image sensor and the lands 13 for connecting the sensor, a frame-shaped rib 17 formed on one surface of the resin base material 12 and a transparent cover plate 24 attached on the frame-shaped rib 17. A first organic film 15 formed on one surface of the resin base material 12 and a second organic film 16 formed on the other surface thereof. The first organic film 15 and the second organic film 16 consist of a solder resist, the content of a filler for the first organic film 15 is higher than that for the second organic film 16 and is kept within a range of 50 to 90 wt.%. COPYRIGHT: (C)2008,JPO&INPIT
|
