发明名称 METHOD FOR MANUFACTURING SUBSTRATE SETTING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate setting board for preventing leaving of residues of spraying materials within a fluid route, generation of contamination due to the residues of the spraying materials and also generation of clogged fluid route. <P>SOLUTION: A removable film 540 is formed to a gas supply route such as the internal surface of a gas discharging hole 511 and an internal surface of a groove 512. Next, while a gas such as the compressed air is injected from each gas discharging hole 511 by supplying the gas like the compressed air, a ceramic spraying film 10, a metal spraying film (electrode) 12, and a ceramic spraying film 10 are sequentially laminated on the setting board surface to form a three-layer electrostatic chuck 11. Next, fluid, for example, organic solvent such as acetone or the like, compressed air, water or the like is introduced into the groove 512 to remove and wash the film 540. Accordingly, solid spraying ceramic 530 adhered in the ceramic spraying step can be removed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008153315(A) 申请公布日期 2008.07.03
申请号 JP20060337684 申请日期 2006.12.15
申请人 TOKYO ELECTRON LTD 发明人 NAGAYAMA MASAYUKI;UEDA TAKEHIRO;KOBAYASHI YOSHIYUKI;OHASHI KAORU
分类号 H01L21/3065;C23C14/50;C23C16/458;H01L21/205;H01L21/683 主分类号 H01L21/3065
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