发明名称 |
Wiring substrate, manufacturing method thereof, and semiconductor device |
摘要 |
In a wiring substrate according to the present invention, a base wiring board is constructed by stacking a plurality of unit wiring boards each having wiring patterns which enable an electrical connection between upper and lower sides, in a state that the plurality of unit wiring boards are connected to each other via a connection terminal, and a silicon interposer is stacked on the base wiring board via a connection terminal, and a resin portion is filled in a gap between the plurality of unit wiring boards as well as a gap between the base wiring board and the silicon interposer, and a resin portion serves as a substrate which integrates the base wiring board and the silicon interposer.
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申请公布号 |
US2008155820(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20070984004 |
申请日期 |
2007.11.13 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
ARAI TADASHI;KOBAYASHI TOSHIO |
分类号 |
H01L23/48;H05K3/36 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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