发明名称 Diamond Enhanced Thickness Shear Mode Resonator
摘要 A thickness shear mode (TSM) resonator is described, comprising a diamond layer. The diamond layer is preferably a high quality diamond layer with at least 90% sp<SUP>3 </SUP>bonding or diamond bonding. A method for manufacturing such a resonator is also described. The thickness shear mode resonator according to embodiments described herein may advantageously be used in biosensor application and in electrochemistry applications.
申请公布号 US2008157632(A1) 申请公布日期 2008.07.03
申请号 US20070944364 申请日期 2007.11.21
申请人 INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC);UNIVERSITY HASSELT 发明人 WILLIAMS OLIVER
分类号 H01L41/047;B05D1/36;B05D3/04 主分类号 H01L41/047
代理机构 代理人
主权项
地址