发明名称 Thermally coupling an integrated heat spreader to a heat sink base
摘要 The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
申请公布号 US2008156457(A1) 申请公布日期 2008.07.03
申请号 US20080075528 申请日期 2008.03.12
申请人 SCHAENZER MATTHEW J;FITZGERALD THOMAS J;RENFRO TIM A;DHINDSA MANJIT;TRIVEDI VAIBHAV P 发明人 SCHAENZER MATTHEW J.;FITZGERALD THOMAS J.;RENFRO TIM A.;DHINDSA MANJIT;TRIVEDI VAIBHAV P.
分类号 H05K7/20 主分类号 H05K7/20
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