| 摘要 |
A semiconductor package and a method for manufacturing the same are provided to prevent an electrical short between solder bumps by forming a bump guides between the solder bumps to form the package. Plural bonding pads(202) and a protective layer(204) are formed on an upper surface of a semiconductor chip(200). A first mask pattern is formed on the semiconductor chip to expose a part of the protective layer between the bonding pads. An insulating material gap-fills the exposed protective layer to form a bump guide(206). The first mask pattern is removed. A seed layer(208) is formed on the semiconductor chip including the bonding pad and the bump guide. A second mask pattern is formed to expose the bonding pad. A solder bump(212) is formed on the seed layer of the exposed bonding pad. The second mask pattern and the seed layer on a lower portion thereof are removed. |
