| 摘要 |
A plating apparatus for a printed circuit board is provided to minimize consumption of additives added to a plating electrolyte and to prevent defects caused by bubbles. A plating apparatus for a printed circuit board comprises a plating bath(100) for storing a plating electrolyte(130), an insoluble anode(110) immersed in the plating electrolyte, a cathode(120) immersed in the plating electrolyte, a rectifier(140) for applying direct current to the anode and cathode, respectively, and an isolation layer(150). The isolation layer is made of a fabric, a non-woven fabric, a mesh having acid resistant property, or a sponge. The isolation layer prevents the electrolyte from being transferred from the insoluble anode to the cathode.
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