TEST STRUCTURE FOR ESTIMATING ELECTROMIGRATION EFFECTS WITH INCREASED ROBUSTNESS WITH RESPECT TO BARRIER DEFECTS IN VIAS

摘要

By providing vias of increased mass flow blocking capability next to respective line segments of an electromigration test structure, the reliability of respective assessments may be enhanced, since electromigration-induced void formation in the test line segment under consideration may be efficiently decoupled from metal diffusion of neighboring test areas of the test structure.