发明名称 |
Electric circuit device and the manufacturing method |
摘要 |
An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.
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申请公布号 |
US2008158824(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20070003037 |
申请日期 |
2007.12.19 |
申请人 |
AISIN AW CO., LTD.;FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD. |
发明人 |
AOKI KAZUO;TSURUOKA JUNJI;YASUI SEIJI;KABATA YASUSHI;SOYANO SHIN |
分类号 |
H05K5/06;H05K3/36 |
主分类号 |
H05K5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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