发明名称 THERMOELECTRIC TUNNELLING DEVICE
摘要 <p>Methods and apparatuses for making a thermotunneling device. A method in accordance with the present invention comprises metal/semiconductor or semiconductor/semiconductor bonded material combinations that allows current flow between a hot plate and a cold plate of a thermoelectric device, and interrupting a flow of phonons between the hot plate and the cold plate of the thermoelectric device, wherein the interrupted flow is caused by a nanogap, said nanogap being formed by applying a small voltage or current between the two sides of the thermoelectric device.</p>
申请公布号 WO2007081483(A3) 申请公布日期 2008.07.03
申请号 WO2006US47587 申请日期 2006.12.13
申请人 THE BOEING COMPANY;TANIELIAN, MINAS, H. 发明人 TANIELIAN, MINAS, H.
分类号 H01L35/00;H01J45/00 主分类号 H01L35/00
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