Semiconductor packing comprises packing substrate, contact positioning structure of one type, arranged in area of packing substrate, where contact positioning structure of another type is arranged in another area of packing substrate

摘要

The semiconductor packing comprises a packing substrate (50) and a contact positioning structure of one type, which is arranged in an area of the packing substrate. A contact positioning structure of another type is arranged in another area of the packing substrate. The contact positioning structure of one type comprises a conducting contact positioning, which is arranged on the packing substrate. An independent claim is also included for a module printed circuit board with a circuit substrate and an assembly area.