| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein a thermal stress and crack must be restrained from being generated caused by the difference between linear expansion coefficients generated between respective materials, in an electronic device required to mount an electronic component for the purpose of electrostatic charge countermeasure. SOLUTION: The crack generated in a connecting material 14 is restrained from progressing, by combining positioning recesses 12, 13 with a connecting material thickness securing recess 16, a connecting material thickness securing protrusion 17 or the like, in electronic component mounting parts 7, 8 of lead materials 9, 10, 11, and reliability is enhanced thereby. The electronic component mounting parts are further sealed and restricted closely with a sealant 6 to restrain the crack generated in the connecting material from progressing, and the reliability of a connection part is secured as its effect. COPYRIGHT: (C)2008,JPO&INPIT |
