发明名称 METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon carbide semiconductor device which can eliminate a fixed charge existing in an insulation film which has an impact on the voltage withstanding performance by a simple method. SOLUTION: The method of manufacturing a silicon carbide semiconductor device includes a process forming a p<SP>-</SP>type electric field relaxing region 4 by ion implantation in the surface of a silicon carbide wafer consisting of an n<SP>-</SP>type silicon carbide layer 2 formed on an n<SP>+</SP>type silicon carbide substrate 1 by an epitaxial crystal growth method; a process of forming an insulation film 7 on the electric field relaxing region 4 by a chemical vapor deposition method; and a process of removing a surface portion of the insulation film 7 by etching to form an insulation film 7'. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008153358(A) 申请公布日期 2008.07.03
申请号 JP20060338416 申请日期 2006.12.15
申请人 MITSUBISHI ELECTRIC CORP 发明人 TARUI YOICHIRO
分类号 H01L21/329;H01L21/28;H01L21/283;H01L21/336;H01L29/06;H01L29/12;H01L29/47;H01L29/78;H01L29/861;H01L29/872 主分类号 H01L21/329
代理机构 代理人
主权项
地址