| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for build-up film insulating layers, which gives cured products having remarkably low linear expansion coefficients and is excellent in film dimensional stability, when used as a material for the build-up film insulating layers, and to provide a build-up film excellent in dimensional stability. SOLUTION: This resin composition for the build-up film insulating layers is characterized by comprising an epoxy resin (A) having a 2,4'-bis(oxyphenylene)sulfone structure represented by general formula 1 in the molecular structure, and a curing agent (B) as essential components. COPYRIGHT: (C)2008,JPO&INPIT |
