发明名称 DEVICE AND METHOD FOR RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a device and a method for resin molding, cleaning a resin molding mold while conducting resin molding without stopping the resin molding process and conducting accurate resin molding by preventing staining of a mold even when a resin having high adhesion to a mold such as green resin is used. SOLUTION: The device comprises pressing devices 10 and 20 equipped with resin molding molds 12 and 22 for resin molding of an article to be molded and a cleaning device 30 for cleaning a mold surface of the resin molding molds, wherein the cleaning device 30 is equipped with an energy-ray irradiation part 31 which irradiates a surface of the resin molding molds 12 and 22 with an energy-ray so that stain stuck and remained in the molds can easily be peeled off from the mold surfaces, whereby the stain is stuck to a molding resin and a molded article and the molded article is released from the molds. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008149705(A) 申请公布日期 2008.07.03
申请号 JP20070279723 申请日期 2007.10.27
申请人 APIC YAMADA CORP 发明人 MIYAJIMA FUMIO;WATANABE YOSHIO;NISHIZAWA TETSUYA;YAMAGISHI HIROAKI;YOSHINO MITSUSHIRO;KATAYAMA TAKASHI
分类号 B29C33/72;B29C33/58;B29C45/76;H01L21/56 主分类号 B29C33/72
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