APPARATUS FOR MANUFACTURING SILICON OXIDE THIN FILM AND METHOD FOR FORMING THE SILICON OXIDE THIN FILM

摘要

A semiconductor thin film element, which has high insulating characteristics equivalent to those of elements currently used as electronic devices and uses a silicon oxide thin film, is provided by performing a low-temperature printing process at a heatproof temperature of a substrate or below to a flexible plastic substrate and the like. A method for forming such semiconductor thin film element is also provided. A coat film composed of a silicon compound having a silazane structure or a siloxane structure is formed on the flexible plastic substrate, the coat film is converted into a silicon oxide thin film, and the semiconductor thin film element is formed by having the thin film as a part of an insulating layer or a sealing layer.