| 摘要 |
A substrate cleaning apparatus and a substrate cleaning method using the same are provided to induce a substrate through high speed conveyance during a photoresist layer removing process and replace stripper with DI water immediately, thereby minimizing contact time when the stripper meets the DI water and preventing erosion of a metal layer by conductivity difference. A stripping chamber(101) sprays stripper for removing a photoresist layer pattern remained on a substrate(100) after etching. A cleaning chamber(103,105) performs DI(De-Ionized) cleaning of the substrate as conveying the substrate at high speed after removing the photoresist layer pattern on the substrate. At least one or more DI knives(121,123) are installed in the cleaning chamber and sprays DI water onto the substrate. A DI rinsing chamber(107) performs ID rinsing of the substrate in a wet conveyor. |
