发明名称 APPLYING APPARATUS AND APPLYING METHOD OF SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide an applying apparatus capable of precisely measuring the quantity of a solution to be discharged from a nozzle of an applying head. SOLUTION: The applying apparatus for solution, by which the solution is supplied and applied to a substrate, is provided with: the applying head 22 having the nozzle for discharging the solution; a piezoelectric device provided on the coating head and worked by applying voltage to the device to discharge the solution from the nozzle; and a measuring device 41 for detecting the length of the solution discharged from the nozzle. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008149239(A) 申请公布日期 2008.07.03
申请号 JP20060338664 申请日期 2006.12.15
申请人 SHIBAURA MECHATRONICS CORP 发明人 KAWAKAMI TSUKASA
分类号 B05C5/00;B05C11/00;B05D1/26;B05D3/00;G01B11/02 主分类号 B05C5/00
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