发明名称 |
Wafer Support and Method of Making Wafer Support |
摘要 |
A wafer support platform is sandblasted with silicon-containing particles to create a surface with uniform roughness. Contaminants become embedded in the surface during the sandblasting procedure. A layer is applied over the surface to isolate the contaminants from a support wafer while maintaining the uniform roughness.
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申请公布号 |
US2008156260(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20060616485 |
申请日期 |
2006.12.27 |
申请人 |
MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
SHIVE LARRY W.;GILMORE BRIAN L. |
分类号 |
C23C16/02;B05C13/00 |
主分类号 |
C23C16/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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