发明名称 Wafer Support and Method of Making Wafer Support
摘要 A wafer support platform is sandblasted with silicon-containing particles to create a surface with uniform roughness. Contaminants become embedded in the surface during the sandblasting procedure. A layer is applied over the surface to isolate the contaminants from a support wafer while maintaining the uniform roughness.
申请公布号 US2008156260(A1) 申请公布日期 2008.07.03
申请号 US20060616485 申请日期 2006.12.27
申请人 MEMC ELECTRONIC MATERIALS, INC. 发明人 SHIVE LARRY W.;GILMORE BRIAN L.
分类号 C23C16/02;B05C13/00 主分类号 C23C16/02
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