Sensor Device, Sensor System and Methods for Manufacturing Them

摘要

A sensor system includes a sensor device ( 10 ) and an integrated circuit ( 20 ) for driving the device ( 10 ). The device ( 10 ) includes a sensor body ( 1 ) of a silicon-based material, an upper sealing member ( 2 ) of a silicon-based material and a lower sealing member ( 3 ) of a silicon-based material. The upper sealing member ( 2 ) and the lower sealing member ( 3 ) are joined together to cooperatively house the body ( 1 ) therewithin in an airtight manner. The device ( 10 ) and the circuit ( 20 ) are formed as a stacked body. The body ( 1 ) is electrically connected to a wiring pattern ( 12 ) of the circuit ( 20 ) through a conductive through-path ( 4 ) penetrating the upper sealing member ( 4 ) and a mounting electrode ( 5 ) provided on an outer surface of the upper sealing member ( 2 ). The device ( 10 ) is connected to an MID substrate ( 30 ) through the circuit ( 20 ).