METHOD OF DIFFUSION-BOND POWDER METALLURGY SPUTTERING TARGET

摘要

Methods for manufacturing sputtering target assemblies and assemblies thereof are provided, particularly targets made of powders. Powders are adhered to a backing plate by use of a vacuum hot press, the powder preferably contacted by non-planar surfaces, and is compressed with at least about 95% density and substantially simultaneously diffusion- bonded to the backing plate.