| 摘要 |
<p>A semiconductor package and a method for manufacturing the same are provided to enhance contact reliability between a bump and a bonding pad by forming grooves for increasing a contact area on the surface of the bump. A plurality of bump pads(102) are formed on a semiconductor chip(100). Bumps having grooves for increasing the surface area are formed on the bump pads. The semiconductor chip is bonded on a substrate. The substrate comprises external contact terminals connected with the semiconductor chip electrically. Bonding pads(122) corresponded with bumps(110) are formed on the substrate. A molding structure(140) protects the semiconductor chip from outside environment by shielding the upper surface of the substrate including the semiconductor chip.</p> |
