| 摘要 |
A method for manufacturing an image sensor is provided to enhance image sensitivity and minimize noise by improving the surface status of a flat layer as O2/N2 ashing. An insulation layer(10) is formed on a semiconductor substrate(1) comprising an optical sensor and a logic circuit. A metal pad(102) is formed above the insulation layer of the logic circuit area. A device protection layer(104,106) are formed on the resultant structure. An opening region exposing the upper part of the metal pad is formed by removing a part of the device protection layer selectively. A first flat layer is formed on the device protection layers of the optical sensor region and the logic circuit region. A color filter array(112a,112b,112c) is formed above the first flat layer. A second flat layer is formed on the color filter array. The first flat layer of the metal pad region in the first flat layer is removed by performing O2/N2 ashing. A micro lens is formed on the second flat layer.
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