| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the lowering of the strength of a bonding section between a heat sink and a package board in a conventional semiconductor device. <P>SOLUTION: A semiconductor device has a wiring board 3, a semiconductor chip 5 mounted on the wiring board 3 in a face-down shape and the heat sink 1 with a recessed section housing the semiconductor chip 5 and collar sections 1a continuously connected to the recessed section. Parts of the collar sections 1a of the heat sink 1 are bonded with the wiring board 3 by an adhesive material 2. The collar sections 1a are warped arcuately in a side view. The base of the recessed section of the heat sink 1 is bonded with the rear of the semiconductor chip 5 by the adhesive material 6. <P>COPYRIGHT: (C)2008,JPO&INPIT |
