| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide technique capable of improving the reliability of a semiconductor apparatus. <P>SOLUTION: The semiconductor apparatus has a semiconductor device which has a metal electrode 12 on at least one main surface, and a die pad (metal member) 13 electrically connected to the metal electrode 12 through conductive resin 7 obtained by mixing Ag particles (metal particles) 9 containing noble metal with base resin (organic resin) 10, wherein a porous nanoparticle coat film (nobel metal layer) 5 having nanoparticles of Ag (nobel metal) sintered on a metal surface is formed on at least one of mutually opposite surfaces of the metal electrode 12 and die pad 13. <P>COPYRIGHT: (C)2008,JPO&INPIT |
