| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of omitting the wiring of an interposer substrate for loading a semiconductor chip and reducing a manufacture cost. SOLUTION: The semiconductor package comprises: a semiconductor chip 1 for which the positions of respective electrode pads 2 constituting the terminals of the power line and grounding lines and signal input/output terminals of the semiconductor chip are distributed on the lower side face of the semiconductor chip and respectively disposed on the basis of circuit arrangement on the side of the semiconductor chip; and the interposer substrate of a single layer structure where conductor posts 5 connected in one-to-one correspondence with the respective electrode pads 2 formed on the semiconductor chip 1 are formed in via holes passing through the substrate and ball pads 7 electrically connected to a mother board are respectively connected to the respective conductor posts and formed on the back surface of the substrate through the respective conductor posts 5. COPYRIGHT: (C)2008,JPO&INPIT
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